Lockheed Martin collaborates with Intel on STAMP program

(CercleFinance.com) - Lockheed Martin will work with Intel Corporation and Altera, an Intel company, to support the STAMP (Stimulating Transition for Advanced Microelectronics Packaging) program of the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).


Lockheed Martin will develop a small size, weight and power (SWaP) airborne electronic defense system, aligned with the Sensor Open Systems Architecture (SOSA), using Altera's Multi-Chip Package (MCP2) for use on the US Navy's MH-60R multi-mission helicopter.

"We're delighted to be working with Intel, Altera and the OUSD to achieve a revolutionary leap in defense systems capabilities, using high-performance semiconductors made in the USA," said Deon Viergutz, Vice President of Spectrum Convergence at Lockheed Martin.

'In the modern battlespace, in the face of modern threats, this technology will be essential to the evolution of existing systems and the development of new systems that keep the military safe by controlling the electromagnetic spectrum and staying one step ahead of the threat. '

'Thanks to STAMP and our collaboration with Lockheed Martin, we have enabled the rapid development of mission-critical defense systems to deliver higher bandwidth and performance with low latency, lower power consumption and a smaller footprint,' said John Sotir, senior director of Altera's Military, Aerospace & Government business and Advanced Heterogeneous Integration Packaging (SHIP).

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